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What is a Flexible Printed Circuit Board? -HeMeiXinPCB

Release time: 25/03/2018

Flex PCB’s are patterns of conductive traces on flexible substrates, or a more precise description is - flexible circuitry for your next best product. Flex Circuits have been in use for some time now but are being utilized far more in every day products as designs become more compact and complex.

So, what is a flexible printed circuit board really? We all have seen many examples of rigid pcb’s and recognize that more and more electronics are being used in every day products and devices. More electronics need more interconnectivity, which rigid pcb’s cannot provide in the form factor of many of these devices.

 

What is a Flexible Printed Circuit Board


That is where flexible printed circuit boards provide the solution. Electronic design has become very demanding of size and shape, and flex pcb’s can bend, fold and be configured to fit into the space as required. Variable thickness and substrates have also made the use of rigid pcb’s almost obsolete. With componentry getting smaller as technology develops the use of flex pcb’s in products has grown significantly.

Flexible printed circuit boards are made up of 2 main parts - conductive traces and substrate - mostly the conductive trace is copper which is then protected by the substrate which is either a polyimide or a solder mask. The use of polyimide is because is offer excellent insolation and is flexible with high resistance to contamination and high temperatures.

Flex pcb’s can be printed in single, double or multi layered configurations depending on the design specification.

 

Single

Layer - a single layer of conductive traces on one side of the substrate - 1 circuit

Double

Layer - a single layer of conductive traces on both sides of the substrate - 2 circuits

Multiple

Layer - several layers of conductive traces on the substrate all separated by insolating material - multiple circuits

Depending on the design specifications for your product there are many combinations of trace/substrate that can be used for you flexible printed circuit board. Factors like temperature, mechanical use, chemical, current and capacitance all have an influence on the manufacturing process. The most common manufacturing process used today is the where the traces are printed or “cut out of a solid sheet and these traces then are imaged or screen printed on to the substrate. This is called the subtractive method. The additive process is the opposite where the traces are printed or plated on to the substrate where needed.

The subtractive method offers the most flexibility and is more robust which allows for more design configurations in your product. The additive process is used for very low current circuitry and this process has less environmental resistance.

Flexible Printed Circuit Boards offer a far wider choice in product design and production, making 3D designs and complex configurations a reality.