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thick copper pcb

Release time: 10/11/2017

Problems encountered in assembling thick copper PCBs are mostly based on cold solder joints, without full flow through to the other side of the via.

A new lower cost manufacturing method assists the assembly by replacing the thick copper pcb protruding up to twenty mils off the surface. The new buried thick copper pcb technology is flat to the surface. The buried thick copper pcb presents a different view of the product because it looks and feels like a normal board, but has up to ten ounces of copper buried into the FR4 under the surface. This new thick copper pcb technology helps assembly companies as the thinner one to two ounce copper pads will solder without a hot plate.

As all the tops of the traces are at the same solder height, paste stencils can be used. However, the ten ounce thick copper pcb area will still need assistance with external heat to properly solder. Buried thick copper pcb boards can have any amount of the copper below or above the surface.

                                                                

Example: Typical ten-ounce power board, eight-ounce below and two ounce copper traces above. Also, the top copper can have any amount of plating added to any tracks as well as the vias. The two-ounce SMT pads are soldered as normal after a hot plate is used to solder a few push in connectors into the ten-ounce section.

Conventional subtractive process

Hemeixinpcb has the capability to build thick copper PCB with copper thickness up to 10 oz or 400 µm by conventional PCB process. We can also apply selective process to make different copper thickness circuits on the same layer.

Plating Copper Under Circuit (PCUC) or “Peacock” process

Hemeixinpcb developed a new process which makes the  thick copper and fine line circuits on the same layer. This novel process is easier than the selective process and other similar process. This patented process electroplates thick copper to fill the cavity under one side of laminate copper foil, just like the electroforming process. After etching the tope side foil, this innerlayer with different copper thickness can be laminated with other inner layer to make multilayer  thick copper pcb board. This process can also make double side thick copper pcb circuits. It is especially a good process to replace I-coin PCB if thin and small coin is needed.