Rigid-flex & flex Capabilities

When you work with Hemeixinpcb, you receive our knowledge and experience, resulting in high quality printed circuit boards. Learn more about our Rigid flex&flex capabilities below.

MANUFACTURING

ODB++(preferred)

FORMATS

HPGL  DXF 

 

Gerber 274X   

 

Excellon

MAXIMUM PANEL SIZE

10″X 60″(250mm X 1500mm)

BOARD THICKNESS

min≥2mil(0.05mm) 

max≤94.5mil(2.4mm),

LAYER COUNT

2~20 Layer

ASPECT RATIO 

16:1

FINISHED HOLE SIZE

6mil (0.15mm) Mechanical Drill

4mil (0.10mm) Laser Drill

LINE WIDTH/SPACE

2mil/2mil (Hoz),,

STIFFENER TYPE

PI stiffener, FR4 stiffener

SHIEDING MATERIAL

Shielding film, 

Silver Based Polymer Thick Film Ink

IMPEDANCE

±10%

SINGLE&DIFFERENTIAL

SURFACE FINISHES

ENIG               ENIPIG

HASL               Immersion Tin        

OSP                Immersion Silver

 

Flex PCB

 

 

Rigid-flex PCB

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