Manufacturing Capabilities

When you work with Hemeixinpcb, you receive our knowledge and experience, resulting in high quality printed circuit boards. Learn more about our pcb capabilities below.

MANUFACTURING FORMATS

ODB++,HPGL DXF ,Gerber 274X ,Excellon

MAXIMUM PANEL SIZE

48″X 24″(1200mm X 610mm)

MAXIMUM THICKNESS

394 mil(10mm),Samples of 689mil(17.5mm)

LAYER COUNT

2~58 Layer,68-Layer for Samples

INTERCONNECT FORMATION TYPES

Back Drilled Blind (laser & mechanical)
Dual Diameter Electrically Isolated Thru Hole Buried SMT

ASPECT RATIO

16 : 1

FINISHED HOLE SIZE

6mil (0.15mm) Mechanical Drill
3mil (0.075mm) Laser Drill

BLIND VIA ASPECT RATIO

1.25 : 1

INTERNAL FEATURES

Inner Layer: 2mil/2mil (Hoz),
Outer Layer: 3mil/2mil (Hoz),

EXTERNAL FEATURES

Inner Layer: 3mil/2mil (Hoz),
Outer Layer: 3mil/3mil (Hoz)
Buried Resistors: Dielectric thickness: 14 μm
Capacitance /area: 6.4 nF/in2
Breakdown Voltage: >100V
3M material, no need license
Buried Capacitance: Resistance (ohms/sq) : 25, 50, 100, 200

MATERIALS

FR-4, Halogen-Free, Rogers, BT, PTFE, PPO, PPE,
Polyimide, Hybrid, Bergquist, Arlon, Taconic and etc.

COPPER PROCESSING

20 oz ,30 oz(Sample)

IMPEDANCE SINGLE&DIFFERENTIAL

±10%,±7.5%,±5%

VIA FILL

Vias filled with LPI/hole fill mask Non-conductive
via fill with epoxy hole fill Conductive via fill with copper paste

PRESS FIT

±2mil(0.05mm)

SURFACE FINISHES

Electrolytic Ni/Au (Hard & Soft) ENIG
HASL       ENIPIG
Immersion Silver      Immersion Tin
Reflowed Tin/Lead       OSP