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complicated double layer pcb manufacturing process

Release time: 24/11/2018

Double panels are usually made of epoxy glass cloth. Unlike the single-layer printed circuit board manufacturing process, the double layer pcb manufacturing process is a more complex process, and SMOBC is a typical process in the double layer pcb manufacturing process. The process is as follows:

Double-sided copper clad laminate → blanking → stacking plate → CNC drill through hole → inspection, deburring brushing → electroless plating (via metallization) → (full plate electroplated thin copper) → inspection, brushing → screen printing negative circuit Graphics, curing (dry film or wet film, exposure, development) → inspection, repairing → line pattern plating → electroplating tin (resistance nickel / gold) → de-printing (photosensitive film) → etching copper → (returning tin) → Cleaning and brushing → Screen printing solder resist pattern (adhesive dry film or wet film, exposure, development, heat curing, commonly used photothermal curing green oil) → cleaning, drying → screen printing character graphics, curing → (spray tin or organic insurance Solder film) → shape processing → cleaning, drying → electrical continuity test → inspection packaging → finished product delivery.

double layer pcb manufacturing process

The key process description of double layer pcb manufacturing process is as follows: 1 CNC drilling, 2 plated hole process, 3 imaging: Screen printing can also be used in double layer pcb manufacturing process, its low cost can be mass produced, but it is difficult to make low Fine wire and fine-distance double-panel below 0.2mm, so now the double layer pcb manufacturing process uses dry film imaging in one step, 4 electroplated tin-lead alloy: the typical process currently in pcb processing - double layer pcb manufacturing process It is a "graphic plating method", 5 etching, 6 heat fusion hot air leveling, gold plating. The double layer pcb manufacturing process is very strict in controlling the etching coefficient during the etching process. Usually, the double layer pcb manufacturing process uses a vertical jet type or a lateral protective agent to increase the etching coefficient at the etching stage.