- Layers (2-64)
- Lines and Spaces (Volume 3/3 Prototype 2/2)
- Glass epoxy (GF) laminate, Tg - 180ºc Epoxy (IT180A, FR370HR etc)
- Polyamide (GI) laminate (35N, NELCO7000, VT901 etc)
- Thermount (BI, aramid) epoxy and polyamide base (85NT etc)
- BT/Epoxy (GMN)
- Teflon base with Aluminum or brass backing
- Low Dk FR4: (FR408HR, MEGATRON6,MEGATRON7, ISPEED ISOLA, NELCO 4000-13 SI)
- Rogers 6000, Rogers 4000, Rogers 3000
- Controlled Impedance (±10% Standard - ±5% Advanced)
- Blind and Buried Vias; Filled via capability
- Buried Capacitance&Buried Resistor
- Resistance (ohms/sq.) : 25, 50, 100, 200
- Advanced thermal management and embedded coin technology
- High Performance and Emerging Materials;
Halogen free,low loss,ultra-thin,mixed packages, inlay
- Sequential Lamination
- High Tech Drilling Capability – Small hole
drilling, Backdrilling
- Mechanical depth control drilling with ±10um
tolerance,min drill size 0.15mm
- Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)
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