flexible printed circuit board
Flexible Printed Circuit (FPC), which generally uses polyimide as a base plate and has a copper foil as a conductor printed circuit on its surface, and has excellent electrical characteristics. Compared to conventional PCBs, FPCs have extremely high flexibility, making them naturally suitable for circuit interconnection in three dimensions. Under the premise of high reliability, FPC can save a lot of installation controls, make electronic devices lighter and thinner, and have good heat dissipation and easy installation. In the development of thinner and smarter devices, the demand from FPC is increasing due to the strong push from mobile phones, tablets, and smart hardware. In addition, in high-end electronic products such as aerospace and medical electronics, the demand for FPC is also increasing. The bigger it is. At the beginning of the 20th century, in order to meet the development requirements of military technology, the United States took the lead in researching flexible electrical interconnection technology. By the late 20th century, FPC was used in the automotive electronics industry where wiring lines were dense and connecting lines needed to be bent. Later, with the increasing demand for FPC in other industries, the global flexible printed circuit board manufacturing industry has developed rapidly. At this stage, Japan is at the leading position in the flexible printed circuit board industry in terms of the manufacturing process and production capacity.
The flexible printed circuit board is mainly composed of the following parts:
Copper foil substrate: The common material structure is copper foil plus core layer. Copper foil: divided into electrolytic copper and rolled copper. Core layer: Commonly known as polyimide (PI).
Protective film: for surface insulation. Commonly used material structure is polyimide (PI) plus adhesive epoxy thermosetting adhesive.
Reinforce: Strengthen the mechanical strength of flexible printed circuit boards.
As a special PCB, FPC has the following advantages:
The wiring density is high, the combination is simple, and the board cost is low.
The thin thickness and lightweight effectively reduce the volume of the product and reduce the weight of the product.
It can be folded for dynamic flexing and 3D stereo mounting. It has high reliability and strong heat dissipation, which is convenient for high integration and high performance of electronic products.