Rigid flex PCB prototyping
Designing a flex or rigid-flex PCB is very much an electromechanical process. Designing any PCB is a 3-dimensional design process, but for flex or rigid-flex PCB design the 3-dimensional requirements are much more important. Why, because the rigid-flex PCB board may attach to multiple surfaces within the product enclosure, and this attachment will probably happen as part of the product assembly process. To ensure that all sections of the finished board fit in their folded location within the enclosure, it is strongly recommended that a mechanical mockup (also known as a paper doll cut out) is created. This process must be as accurate and realistic as possible with all possible mechanical and hardware elements included, and both the assembly-time phase and the finished assembly must be carefully analyzed.
Standard rigid-flex PCB provides a cost-effective alternative to rigid Printed Circuit Board (PCB) modules and Flexible Printed Circuit (FPC) interposers/connector systems used for low to mid-range consumer electronics products. Hemeixinpcb integrates conventional plated through-hole and microvia interconnect processing for intermediate component density designs to give you the best Standard rigid-flex PCB solutions. Moreover, stiffeners, air gap construction, shielding, and overlays from our low-cost flexible circuit systems are routinely applied as per your needs.
With prequalified materials from our matrix of low-cost, Asia-sourced rigid and flex PCB laminates and overlays, you can expect end-to-end solutions optimized for cost-sensitive applications. Beginning with value engineering during the design and specification phase, Hemeixinpcb’s engineers work with you to create an optimal bill of materials and stack-up to deliver low cost, high processing, and assembly yields, and the best field reliability.
During the rigid-flex PCB design process, certain considerations must be taken into account for final product size variations. In the manufacture of rigid-flex PCB boards, the flexible polyimide core will shrink once the bonded copper foil is etched away. This variation must be accounted for in the design process.
The final rigid-flex PCB assembly process requires the flex portions to be bent into shape, stressing the flex laminations with the potential to cause stress fractures.