HDI PCB types

HDI PCB Manufacturing And Its Types

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HDI PCB manufacturing is a process that allows for high-density circuit boards to be made. It can help reduce the amount of space needed in an electronic device, making it less bulky and more portable. As electronics grow smaller and faster, HDI technology becomes even more crucial.

HDI PCB manufacturing has been used in industries as diverse as aerospace engineering, consumer electronics, telecommunications equipment manufacturing, and many others. If you are looking to increase your product's performance by reducing its size without compromising on function or quality, HDI PCB Manufacturing may be just what you need.

We will talk about HDI PCB manufacturers and the types of HDI PCB they work with in this article.

HDI PCB Electronics

HDI PCBs are devices and systems consisting of components where input and/or output connections (pads or pins) are closely spaced. Tight and dense interconnections allow the use of smaller components that can be mounted into space-saving spaces on small boards, enabling manufacturers to create more compact products with greater functionality. HDI technology allows them to transmit signals faster than before, which means they have a lot more deployment opportunities in places like cars, cell phones, etc.


Type 1

With a Type I construction, microvias and conductive vias are used to interconnect. This type of design is described as the fabrication of one single layer on either side (1 [C] 0) or two sides (1 [C] 1).

Type 2

These HDI PCBs include plated buried microvias, plated microvias and may use PTHs for surface to surface interconnection. The buried microvias can be filled with paste or dielectric material during the process of lamination.

Type 3

These boards are made up of plated buried microvias, plated microvias, and may also have PTHs for interconnection. These hidden features can be filled with a paste before the board is laminated together to create an electrical connection between different components on the PCB.

Type 4

The Type four construction is a cutting-edge method of constructing circuit boards that increase the heat dissipation and electrical performance. The core substrate, typically manufactured using conventional printed board techniques, may be used for passive thermal management or shielding as well to greatly improve overall function while simultaneously reducing costs.

Type 5

A Type five construction is a method of manufacturing an HDI PCB that has conductive paste interconnections and plated microvias. The process starts with the manufacture of even layers, then odd layers are laminated on top in such a way as to create electrical connections between them through co-lamination. There can be any number or type of layers (such as 4 layer stacks), but each stack must have at least one hole drilled for connectivity purposes. There will not be enough room if you try to do it without drilling holes.

Type Vl

Type VI boards offer a new way to produce High Density Interconnect PCBs by printing both electrical connection, mechanical structures all together. This process allows designers to have their finished product without any delays due to waiting around for one part of the manufacturing process while other parts come along behind them and they never know what's going wrong until they get back from vacation.

HDI PCB Materials Selection

High-density interconnects are notoriously difficult to design and manufacture. Designing HDI boards isn't just a matter of understanding the limitations that different materials present, but it's also about designing with those constraints in mind.


The delicate microvias of a PCB can cause misregistration and rough edges. Problems may arise with the material properties, such as consistency in weave or quality of fibers used for production. Plasma drilling, laser cutting, or mechanical milling could be performed and these methods introduce potential to close openings by spreading out the fibers - which minimizes open spaces that are responsible for drift and skew.

HDI PCB Manufacturing Process

Building HDI boards is very similar to building other PCBs, with some notable differences. The process begins by choosing a stackup and determining drilling parameters like the hole size for vias or laser-drilling holes in deep layers of copper substrate material.


HDI boards require smaller drill holes due to their thin materials. It’s often necessary to do this work on lasers that can produce more precise and tiny openings than what you would find from drills used when making traditional board designs.


Laser drilling limits depth as well so not all layers of your design will be accessible at one time. But if you're looking for precision over quantity, then there aren't many better options out there. The goal of HDI PCB electronics manufacturing is to produce high-quality and reliable products, so you must understand the process. The first step in this process involves understanding how your board will be manufactured. From there, it's important that you work with both Manufacturing Engineering (ME) and Design for Manufacturability (DFM) to complete a thorough DFM analysis on every component part within your design specification.


Many different types of HDI PCBs can be manufactured, and these boards may vary from one to another. If you’re a customer who needs to have your own custom design made for an application, or if you know exactly what kind of board is needed for your project but need help with the design process, HDI PCB manufacturer Hemeixin will work with you every step of the way.

We offer one-stop shopping by supplying our customers not only with their chosen type of HDI PCB as well as everything they may need from raw materials all the way through final assembly.

This includes working closely with each individual client's engineers on developing a production plan that meets both technical requirements and budget constraints.

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