How to Master HDI PCB Design
Due to technological advancements, it has become increasingly important to pack more functionality into smaller packages. With PCB (Printed Circuit Boards) design, you may worry about extra expenditures and increasing layers. But the good news is that HDI PCB technology allows you to reduce prices without compromising the quality of your products.
In addition to helping you create new items, the technology enables you to develop products that will be around in the future. Now you may wonder what an HDI PCB is and how to master HDI PCB? Stay with us to find out.
Learning the Basics of HDI PCB
In computer networking, HDI stands for High-Density Interconnector (HDI). In other words, a printed circuit board utilizing HDI PCB technology has a higher density of electrical connections per unit area than a standard board. Compared to standard PCBs, these have better spacing and lines, smaller capture pads, tiny vias, and a higher density of electrical connection pads.
HDI PCBs benefit from laser drilling engineering and take up less space, making them ideal for space-saving applications. In simple words, an HDI PCB is a popular choice for reducing a product's size while also enhancing its electrical performance. Mobile phones, touch screens, laptops, digital cameras, and 4G network communications all use high-density PCBs.
How do designers pack so much functionality into even the smallest of spaces? HDI design methodologies and microvias are credited for the success of printed circuits. A PCB with high link density and high layer count can benefit from these microscopic structures, which allow traces to reach the interior layers of the PCB.
For years, these structures have been used in various systems that require several operations to be carried out on a single circuit board. Suppose you've done a size study and found that you need 6 mil or more minor traces to fit all of your components on the printed circuit board due to the density of your design. In that case, microvias may be necessary to facilitate routing across layers.
How to Become an HDI PCB Design Master
HDI PCBs have grown in popularity throughout the years. They are the most incredible option for today's consumers because of their numerous features and benefits. However, an appropriate design is essential for producing high-quality HDI boards. Each PCB is a labor of love that requires a great deal of time and work to make.
Here's how you can become an HDI PCB design master:
Choose Via Types to Minimize Process Complexity
The choice of vias is crucial since it impacts processing time, costs, equipment, and production stages. It is possible to reduce the number of layers and material costs by using microvias (either blind or buried). Still, the complexity of the procedure is affected by the via used.
The machinery and equipment required in the manufacturing process are directly related to your choice of through variety. It can significantly impact both the expenses and the duration of the procedure. By lowering the number of layers and materials, micro vias minimize production time and costs. However, there are various options to pick from (the variants with a near pad or an in-pad via). As a result, you must select the HDI PCB that is the least expensive to manufacture for you or your CM without sacrificing electrical performance.
Prioritize Space Components to Minimize EMI
Despite the small size, you should avoid placing components next to each other because the board can warp if locations are unevenly distributed due to component placement. The number of usable boards per panel created can have a substantial impact in terms of yield rate. EMI (Electromagnetic Interference) can affect signal integrity when high-powered devices are used. Additionally, near pad inductances and capacitances may impact signal quality and transmission speed.
As a result, evenly distributed vias around the surface also aid in stress reduction, ensuring that the intended impact is not distorted in any way. To swiftly rework and connect later, you need to consider the maintenance and installation steps.
Here's a breakdown of the required spaces between the components:
|Component in HDI||Spacing|
|Ordinary SOP and PIN (Other Components)||40 Mil|
|BGA and PIN (Other Components)||80 Mil|
|PIN (Ordinary Components)||20 Mil|
Avoid Solder-Related Issues
Solder can cause many HDI PCB difficulties if designers aren't attentive. It weakens the connection when the solder is siphoned away from specific components via-in-pads. The HDI PCB design and the application may make this difficult in some cases. The problem can be resolved by applying a solder mask to via-in-pads. On the other hand, using a solder mask can cause issues of its own.
As a result, pins might become disconnected when solder masks with large openings are used. Designers need to keep an eye out for potential solder difficulties before working on a project.
Pay Attention to Design Reviews
All PCB designers should be aware of the fact that HDI requires special attention. For designers, it can be challenging to take a step back from their work and look for minor mistakes. This is made considerably more difficult by the increased component density that designers must contend with. Taking advice from other designers and technologists is a smart way of avoiding costly mistakes in the early stages. To meet deadlines, it may be easy to forgo design reviews, but in the long run, these evaluations are the most cost-effective approach to save both time and money.
All right, that was a lot of information to take in. Don't worry, you don't need to be an expert to master the HDI PCB. Choosing an HDI PCB manufacturer with a capable staff of engineers is the name of the game. They'll take care of everything for you. And that's where HemeixinPCB comes in.
Here at HemeixinPCB, we have a wide range of production capabilities to readily produce prototypes based on your designs. We conduct dependability tests on our goods to meet our high-quality standards. Head to our website and get a quote.