Microvia HDI PCBs

flex & rigid flex PCB: – extra copper condition

I need some info. on acceptability criteria for rigid, flex & rigid flex PCB: – if extra copper condition (copper on non copper defined area) on PCB is acceptable provided – it is not violating electrical spacing or 5 mil criteria…

I have some PCB with 5 to 6 occurrence of copper patches (close to the PCB edges in the static part without violating IPC-6013 criteria for foreign material…though it is Cu. ) on both near and far side. It is repairable …but would like to know of any existing documents …

I need help on :

-Which IPC spec. should I refer to ..is there any other spec I should look for..I have never come across any SOW with this criteria …(like IPC-6013 foreign material inclusion..)

-What are the rigid flex PCB concern in terms of RF, power, reliability, electrical and impedance characteristics for this condition..or is there any ?

– Any source of info.

roll-up IPC-A-600 and smack those bums on the nose with it and say “Bad rigid flex PCB fabricator don’t do that on the floor again” in a firm voice. I know I’m just rushin too much to concentrate on it. But yano even if it isn’t in A-600, it doesn’t make sense that you rigid flex PCB fab should be able to add copper without your approval.

This particular p/n calls for print&etch for wet process..and the problem occured due to rigid flex PCB surface contamin. with resist residue resisting copper from etching off. The high pressure nozzle was a problem at developing oper. and it is fixed now.

We are runing this P/N in proto. hence we waived this problem for now…(we could termed this problem as process indicator condition) but would like to know for documenting characterization procedure.

Thanks for the help again.

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