We got a PCB prototype inquiry from the US that requires high volume 8 layer 1.0mm PCB, OSP + selective ENIG surface, 5 groups impedance control, and stacked vias. These requirements are common, but there are 2/2mil lines in inner layers. It’s said that this PCB prototype order was produced at Foxconn. Any PCB prototype manufacturer can do it?
I think most manufacturers can not make this PCB board with a 2/2mil line in high volume since the bad rate is high. But anyway you can share your Gerber files to some professional HDI PCB prototype manufacturers, like email to [email protected]
it’s said that Hemeixinpcb is trying to manufacture this PCB prototypes to check whether they can put it into mass production.
These HDI PCB prototypes have succeeded yesterday. I’m proud I have a chance to review the working Gerber in the MI department. Hemeixinpcb proved their processing capacity and confirmed they can manufacture this 4+n+4 PCB in high volume.
- 18 groups controlled impedance with single-sided and diff.
- 1.8, 2.1, 2.2, 2.3, 2.5, 2.6, 3.0 mil lines in inner &outer.
- 8 BGA with via-in-pad.
- staggered vias, blind vias & buried vias.