Rigid-flex Circuits Stackup
Rigid-flex circuits is a complicated product that demands a lot of interaction between the PCB provider and the customers. Like other complex products, early discussions between Hemeixinpcb and the designer is necessary to optimize the design for manufacturability and to optimize costs. Hemeixinpcb supports rigid-flex circuits boards for higher volume requirements.
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Rigid-flex circuits technology using ELIC is receiving an increased emphasis on new product designs to achieve:
Higher volumetric interconnection of components and structural featuring within the PCB.
Elimination of traditional connectors and ACF bonding FPCs to rigid PCBs within here cost and reliability issues.
Laminate, Materials, Chemistry and Equipment suppliers roadmaps are on track to provide compatible LF/HF materials and µvia process systems for Rigid-flex to move to the mainstream.
Global market demand for Smartphones and Tablets have accelerated (and funded) the technology development of stacked µvias and associated mass production infrastructure.
Filled via rigid-flex circuits technologies are now essential rigid-flex circuits PCB fabrication processes to achieve high SMT yield and reliability for Area Array IC package and fine pitch passive components assembly.
Filled and stacked µvia sequential processing is maturing to very high yields.
Conventional PTH Rigid-flex circuits Product Examples
ELIC HDI Rigid-flex circuits Technologies
- Filled µvia HDI
- Technical Advantages of solid via
- Improved solder joint reliability
- Elimination of air bubble
- Reduce solder short in BGA (0.5mm pitch or less )
- Improved PCB design
- Enhance circuit routing flexibility
- Size reduction of PCB
- Improve thermal performance
- Enhance signal quality (shorter path)
- Plated stacked uVia Process overview