Rigid-Flex PCB Technology

Rigid-Flex PCB Technology

Micro vias HDI rigid-flex circuit boards technologies include blind and/or buried vias processes and often micro vias with a higher circuitry density than traditional PCB’s. Integrating HDI PCB Technologies with Rigid-flex PCB and HDI PCB. Every Layer Interconnect(ELIC HDI PCB) & Rigid-flex PCB are now available at Hemeixin Electronics Co., Ltd.

Rigid-Flex PCB Technology

HDI PCB Boards contain blind and/or buried vias and often contain micro vias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

There are 6 different types of HDI PCB boards, through vias from the surface to surface, with buried vias and through vias, two or more HDI PCB layer with through vias, a passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

Rigid-Flex PCB Technology:

lMulti-layer HDI (high-density interconnect)/micro vias rigid-flex circuit boards for 3D-miniaturization

sequential, parallel, symmetric and asymmetric build-ups

High-frequency, high-temperature, and ruggedized rigid-flex solutions

high-frequency rigid-flex HDI solutions based on LCP (liquid crystal polymer) base material

Thinned bending zones

the high variety of flex and rigid base materials, surface protection and surface finishes.

Polyimide rigid-flex circuits Capabilities:

  • Lines/spaces:35/40 µm
  • micro vias/pads diameter (flex):50/200 µm
  • micro vias/pad diameter (rigid, laser):75/200 µm
  • Through vias/pads diameter (rigid, mech.):125/300 µm
  • Thinnest dielectric thickness (flex):12 µm
  • Thinnest dielectric thickness (rigid):60 µm
  • Conductor width tolerance:+/- 20%
  • Artwork to solder mask tolerance:+/- 50 µm
  • Layer count up to 20

Advanced rigid-flex circuits PCB techniques

  • Lines/spaces:25/35 µm
  • micro vias/pads diameter (flex):40/100 µm
  • micro vias/pads diameter (rigid, laser):50/150 µm
  • Thinnest dielectric thickness (flex):12 µm
  • Thinnest dielectric thickness (rigid):46 µm
  • Conductor width tolerance:+/- 15%
  • Artwork to solder mask tolerance:+/- 25 µm
  • Layer count up to 24

Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another.

The proper application of Rigid-Flex circuit boards offers optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components.

Additional advantages of Rigid-Flex circuit boards are dynamic and mechanical stability, the resulting 3-dimensional freedom of design, simplified installation, space savings, and maintenance of uniform electrical characteristics.

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