The pcb layers structure includes single-panel, dual-panel, and multi-layer boards.
The PCB layers structure includes single-panel, dual-panel, and multi-layer boards. In PCB layers, the single panel is covered with copper on one side, copper is not coated on the other side for wiring and soldering, and components are placed on the other side.
In the PCB layers, the top and bottom layers of the double-panel have copper-clad boards, and both sides can be wired. However, unlike these, the multi-panel, which is the most high-tech component, is superposed and bonded in the PCB layers by alternating layers of conductive patterns and insulating materials, except for the conductive film on the top and bottom surfaces of the board.
There is also one or more electrically conductive layers that are insulated from one another, with electrical connections between the layers through metalized vias.
In other words, in fact, the entire PCB layers include the top, bottom, and middle layers. The inner layer of the PCB layers is an insulating layer for isolating the power supply layer and the wiring layer.
For the editing and manufacturing of PCB layers, ARES technology can support 16 copper foil layers, 2 silkscreen layers, 4 mechanical layers, 1 board boundary layer, 1 forbidden wiring layer, 2 solder mask layers, and 2 Solder paste layer.
These different layers each have their own working properties, such as the Prohibit wiring layer: used to define the area on the board that can effectively place components and wiring. A closed area is drawn in this layer as the effective area of the wiring, and it is not possible to layout and route outside the area.
The different working performance between these layers and layers ensures the composition of the board and also ensures the quality of the work of each electronic product.