A CAM hold is a delay in engineering caused by issues in the PCB files submitted for the job. The most common reason for CAM hold is DRC errors in the PCB file. DRC stands for Design Rule Check. A PCB must pass a set of rules in order for it to be manufacturable, such as copper-to-copper spacing, and minimum via hole diameter. The manufacturer provides these design rules to the designer, and the designer uses his/her PCB software to run a DRC on the PCB layout. Any violation of the design rules constitutes a DRC error.
You can help to ensure that your PCBs gets manufactured without being put on hold. Please review these common reason for on-holds.
Drill chart does not specify holes attribute(plated or non plated holes).
The drawing does not show or specify drill symbols.
The unplated holes were provided with pads larger than the drilled hole.
Drawing defined some holes are plated through holes, but some of them were without copper pad on all layers.
This board hasn’t bigger non-plated holes. So it can’t support the board during Fabrication and Test processes at Hemeixinpcb PCB Production.
Per Hemeixinpcb current capability, We need fabricate 0.055″x0.035″ plated slot by rout process, but the tolerance of +/-0.003″ can not be guaranteed.
It is too small that we can’t ensure backdrill hole full drill through PTH hole due to there was true positional deviation between backdrill hole and PTH hole.
The specified stackup total thickness does not match finished board thickness.
The xxx impedance traces listed on the drawing are not present in the design.
Copper extends to the rout profile and will result in exposed copper and burrs.
Copper to board edge clearances to the short and long v-score lines are only .001 on inner and the outer layers. The v-score will exposed and have copper burring. Hemeixinpcb requests approval to clip back the copper from the score lines by 15 mils.
Pad to pad distance of less than 7 mils is not enough to build solder mask dams in between pads and at the same time ensure there will be no solder mask on pads.
Due to the ceramic nature type of Rogers material’s, Hemeixinpcb can not run solder mask up to the edges of any routed or scored edge’s with-out chipping the mask during it’s fabrication process. Relieve solder mask 8 mils away from routed or scored edge’s to prevent solder mask chipping.
Some texts in xxx side are mirrored.
There are silkscreen Characters outside the board profile.
No specified plating gold thickness for hard gold contacts.
Provided netlist file does not match Gerber generated netlist.
Provided components of Part number does not match your description.
Provided Resistor or Capacitor of Part number xxxx does not match your description value.
Component of xxx is not widely available，It is difficult to purchase. Please provide your alternative part number of components or provide these component from your side.
The Assembly Drawing does not specify the Reference Designator Polarity (cathode, anode, pin number and what the dot or plus sign indicate) of XXX.