Rigid PCB

Product design, system speed requirements, microprocessor and component scaling, and increased thermal performance are driving advances in PCB technology every day. Hemeixin's technical and production capability and aggressive technology roadmap has kept pace with these changes and provides a scalable platform for growth.

  • Layers (2-64)
  • Lines and Spaces (Volume 3/3 Prototype 2/2)
  • Glass epoxy (GF) laminate, Tg - 180ºc Epoxy  (IT180A, FR370HR etc)
  • Polyamide (GI) laminate (35N, NELCO7000, VT901 etc) 
  • Thermount (BI, aramid) epoxy and polyamide base (85NT etc) 
  • BT/Epoxy (GMN) 
  • Teflon base  with Aluminum or brass backing
  • Low Dk FR4: (FR408HR, MEGATRON6,MEGATRON7, ISPEED ISOLA, NELCO 4000-13 SI) 
  • Rogers 6000, Rogers 4000, Rogers 3000 
  • Controlled Impedance  (±10% Standard - ±5% Advanced)
  • Blind and Buried Vias; Filled via capability
  • Buried Capacitance&Buried Resistor
  • Resistance (ohms/sq.) : 25, 50, 100, 200
  • Advanced thermal management and embedded coin technology
  • High Performance and Emerging Materials;
     Halogen free,low loss,ultra-thin,mixed packages, inlay
  • Sequential Lamination
  • High Tech Drilling Capability – Small hole
     drilling, Backdrilling
  • Mechanical depth control drilling with ±10um
    tolerance,min drill size 0.15mm
  • Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)

 

PCB Fabrication

PCB Fabrication

Solution

PCB Fabrication                  PCB Fabrication

PCB Fabrication                          PCB Fabrication