We Always Perform Signal Integrity Analysis for High Speed PCB
The digital circuit is a powerhouse and high-speed PCBs are full of microprocessors and other components that are managing billions and billions of operations each second. That means any flaw or error in design can cause a significant issue and prevent proper operation.
It’s important for any high speed PCB to be properly engineered to reduce flaws through elements such as impedance discontinuities in transmission lines, improper plating of the through-hole interconnections or other losses of PCB signal integrity.
Hemeixin has the experts on-hand to achieve the results you need. We know most digital, high-speed applications have long since risen above the operational efficiencies offered by standard FR-4 materials, so we’ll make the right recommendations and prevent you from having performance issues.
The hybrid PCB stack-up can be used as one of enablers to improve SI for signals routed on selected layers. For a hybrid PCB stack-up, some layers of the PCB use low loss dielectric while the others are fabricated with the traditional FR4. The cost of such a hybrid stack-up is normally lower than all low loss material PCB stack-up, but with the advantage of some routing layers having the same or similar low loss properties as an all low loss stack-up, thus achieving optimized cost-performance. As a contrast to re-driver/re-timer solution which improves SI performance for selected number of links, a hybrid PCB stack'up can improve SI performance for selected routing layers. A hybrid stack-up can also be built by mixing low loss material with ultra-low loss material to further reduce loss in the routing. In short, a hybrid PCB stack-up has the following features:
There are different options and associated costs for creating a hybrid PCB stack-up. For example, one can use same materials (high loss or low loss) for all the prepreg(PP) layers, and different types of materials for core layers. Another example is to form top and bottom layers as low loss while keeping all other layers FR4, thus having two microstrip routing layers as low loss.
For microstrip, a hybrid PCB stack-up has the same performance as all low loss stack-ups, as long as the dielectric of the outer layer is low loss. In other words, if the signals requiring low loss material are only routed on outer layers, the hybrid PCB can get the identical loss performance compared to all-low-loss stack-up, while significantly reduces the material cost.
The signal may not get full benefit of low loss material unless both sides of the dielectric is low loss material. very often, for stripline in a mixed dielectric PCB stack-up, one side of material is low loss while the other side of material is high loss.For stripline with high loss and low loss dielectric materials on the top and the bottom of the signal layer, the loss is expected to be higher than striplines with same stack-up of all low loss materials on both sides, but lower than striplines with same stack-up using high loss materials on both sides.
Manufacturing capability and the stack-up implementation recipe for a hybrid PCB can differ among PCB manufacturers. The optimal performance-cost solution also depends on the number of signal layers, routing length, material selection, etc. It is necessary to consult your PCB manufacture for the capability and the risk associated such as the yield, de-lamination, etc.
RF and microwave PCB with high frequency laminates can be difficult to design because of the sensitivity of the signals, especially compared to other digital signals.
Here are a few things to consider that ensure your design is efficient and minimizes the risk of failures, signal disruptions and other intrusions.
Flex and rigid-flex PCB technology offers reduced weight and space savings. Today’s small lightweight consumer electronics are often built with rigid-flex technology, however, there can be many challenges in successful rigid-flex PCB design. Browse our website of pages to learn more about PCBs and rigid-flex design for flexible electronics and wearable designs.
Standard Rigid-Flex provides a cost-effective alternative to rigid Printed Circuit Board (PCB) modules and Flexible Printed Circuit (FPC) interposers/connector systems. Hemeixin integrates conventional plated through-hole, and microvia interconnect processing for intermediate component density designs to give you the best Standard Rigid-Flex solutions. Hemeixin incorporates stiffeners, air gap construction, shielding, and coverlays from our FPC systems as needed.
Hemeixin provides industry-leading HDI capabilities to optimize today's challenging designs. The use of HDI and Every Layer Interconnect (ELIC) stacked copper filled µVias, fine feature etching, and precision registration provide unique, mass-production solutions for complex designs.
With extensive investments in leading-edge production systems, rigid HDI PCB Hemeixin can build the next generation of interconnect solutions.
Rigid-Flex designs utilizing HDI/ELIC capabilities eliminate the need for the module connectors and saves precious space within the slim, high-style designs compact designs. Hemeixin provides this new end-to-end solution from initial design to mass production.
With prequalified materials from our matrix of low-cost, sourced rigid and FPC laminates, coverlays, stiffeners, and shielding, Hemeixin provides end-to-end solutions optimized for cost-sensitive applications. Hemeixin offers engineering support during the design and specification phase, to create an optimal bill of materials and stack-up to deliver low cost, high processing, and assembly yields, and the best reliability.
The processes involved in the production of HDI PCBs are often different than those used with other PCB types. Here’s what you need you know about HDI board production and some of the design considerations you’ll want to keep in mind to keep in mind throughout the production process: