backplane PCB Manufacturing

IC Substrate

IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing. Flip Chip technology is the foundation for packaging high performance Integrated Circuits used in applications from consumer-level smartphones, tablets and PCs to high-performance graphics workstations, servers and IT infrastructure equipment. IC substrates serve as the connection between the IC chip(s) and the PCB through a conductive network of traces and holes.

Advanced technology that is shaping the future. Hemeixinpcb produces many types of IC substrates on which IC chip(s) are attached to the IC substrate utilizing wire bonding and, or flip-chip methods. Our IC substrates that Hemeixinpcb manufacturers include:

Ic Substrate manufacturer
  • CSP (Chip Scale Packages)
  • FC-CSP (Flip Chip) CSP
  • BOC (Board on Chip)
  • PoP (Package on Package)
  • PiP (Package in Package)
  • SiP (System in Package)
  • RF Module
  • LED Package

IC substrates Capabilities:

BGA substrates
  • Layer count : 1L / 2L / 3L / 4L , up to 22 layers.
  • Minimum line width and spacing: 9/9 µm
  • Minimum laser via/pad: 45/95 µm
  • Impedance control for critical signal traces
  • RoHS compliance materials
  • Bump pad: minimum 130 µm bump pitch
  • Structure: any layer, coreless, cavity, embedded passive, Embedded trace (down to 20 um pitch)
  • Wide material and surface finish options available
  • Thickness: 100 um (1.5L) ~ 225 um (5L)
  • Smallest Package Size: 3 x 3 mm up to 15 x 15 mm

Ic Substrate Applications:

BGA substrates manufacturer
  • Hand-held, Mobile, Networking
  • Smart phone, Consumer electronics and DTV
  • CPU, GPU and Chipset for PC application
  • CPU, GPU for Game Console (eg. X-Box, PS3, Wii…)
  • DTV Chip Controller, Blu-Ray Chip Controller
  • Infrastructure application (eg. Network, Base Station…)
  • ASICs
  • Digital Baseband
  • Power Management
  • Graphic Processor
  • Multimedia Controller
  • Application Processor
  • Memory card for 3C products (eg. Mobile/DSC/PDA/GPS/Pocket PC/NoteBook)
  • High Performance CPU
  • GPU, ASIC Devices
  • Desktop / Server
  • Networking
  • Game Console

BGA Package substrates process

What is semi additive process ?

Semi Additive Process (SAP) Technologies:

Electronic industry is rapidly moving towards finer pitches to accommodate higher speed required out of components. We have seen a migration from 1mm pitch to 0.8, 0.5, 0.4 and now 0.25mm pitches. At the same time the number of I/O required are increasing. We have started seeing increasing designs with sub 50µm (0.002”) line and spacing. Convention methods of forming traces are not going to be able to produce these circuit boards at a reasonable yield.


  • Reduction in size and weight by 90% over current state-of-the-art in the China
  • Effectively reduce layer count and lamination cycles
  • Significant RF advantages over traditional subtractive etch processes
  • Increased electronics density within a fixed area

Technical Papers:

  • Material Reliability & Performance Study
  • Stack Microvia Reliability
  • Wrap Plating
  • Trouble shooting Microvias

Conductor Patterning Technology to Enable Ultra-Fine Wiring

With a focus on SAP (Semi Additive Process), we provide the world-class micro patterning. We are also promoting the development of conductor patterning technologies of semiconductor revel toward future.

mSAP - modified Semi Additive Process

Miniaturization and new market requirements demand the development of innovative solutions in order to provide our customers with the best possible production technologies in the future. One of these innovations to meet the increasing demand in the field of fineline PCB’s is our activity in the development of the modified Semi Additive Process (mSAP).

The mSAP technology allows much finer structures down to 25my line / space. In addition, this process offers a significantly better conductor pattern geometry. For high-frequency applications, this offers great performance advantages. This technology can also offer decisive advantages for interposer PCBs and high-speed PCBs.

At the conventional subtractive process, structures are created by laminating, exposing and developing a photoresist as etch protection on the copper surface. The unprotected copper is then removed by an etching medium. At Hemeixin, conductor pattern of 50µm and larger can be produced by this way with high reliability.

If finer conductor patterns are to be formed, the subtractive process reaches its limits. One solution to this problem is the Semi Additive Process, which has been used in the semiconductor industry for a long time and is now becoming increasingly important in the production of printed circuit boards. Since the described variant is a modified version, this process is called modified Semi Additive Process (mSAP).

The mSAP process uses only a thin layer of copper applied to the laminate. Then a photostructurable solid resist is applied and the layout is exposed and developed inverted. The desired copper thickness is added to the exposed copper areas in the electroplating process. After removing the solid resist, the thin initial copper layer is removed by differential etching.

Our product selection for modified Semi-Additive Process (mSAP) for high density circuitry is increasing yields and enabling new designs. mSAP is a cost-effective process for fine line substrates which allows for a high degree of automation, high yields, and lean manufacturing. Hemeixin Electronics Co.,Ltd has a portfolio which encompasses every process step including circuit formation, copper electroplating, etching, and final finishes.

As higher densities are required to encompass all of the functionality required for today’s mobile devices, IC substrates, and substrate-like printed circuit boards (PCBs), manufacturers began relying on mSAP to meet their design requirements. Reliable technologies that can deliver the yields and quality necessary for this challenging manufacturing paradigm are only offered by chemical suppliers with the technical expertise and technological capability to deliver.

Hemeixin Electronics Co.,Ltd offers a complete suite of specialty solutions for manufacturing with high density mSAP, enabling our customers to achieve results that they would otherwise be unable to with regular process chemistry. Our copper reduction technologies allow for precise tuning of copper foil thicknesses, while our innerlayer and laser drilling pretreatment processes enable high signal speeds and tight via tolerances. Our low-etch direct metallization processes allow for fewer copper interfaces and higher quality fine line resolution due to reduced etching. Our leading edge copper electroplating technologies enable fine lines and spaces with zero planarization between layers, and can even eliminate v-Pitting without the need for baking the panels after plating.

Our high resolution final etch defines traces with excellent sidewall profiles and zero undercut, and our selection of final finishes offers a wide variety of functional surfaces to meet assembly requirements. Global device original equipment manufacturers (OEMs) are using our cutting edge manufacturing processes for mSAP to power the next generation of high performance electronic devices that are being built today.

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