Manufacturing Capabilities


When you work with Hemeixinpcb, you receive our knowledge and experience, resulting in high quality printed circuit boards. Learn more about our pcb capabilities below.

MANUFACTURING FORMATS ODB++,HPGL DXF ,Gerber 274X ,Excellon
MAXIMUM PANEL SIZE 48″X 24″(1200mm X 610mm)
MAXIMUM THICKNESS 394 mil(10mm),Samples of 689mil(17.5mm)
LAYER COUNT 2~58 Layer,68-Layer for Samples
INTERCONNECT FORMATION TYPES Back Drilled Blind (laser & mechanical)
Dual Diameter Electrically Isolated Thru Hole Buried SMT
ASPECT RATIO 16 : 1
FINISHED HOLE SIZE 6mil (0.15mm) Mechanical Drill
3mil (0.075mm) Laser Drill
BLIND VIA ASPECT RATIO 1.25 : 1
INTERNAL FEATURES Inner Layer: 2mil/2mil (Hoz),
Outer Layer: 3mil/2mil (Hoz),
EXTERNAL FEATURES Inner Layer: 3mil/2mil (Hoz),
Outer Layer: 3mil/3mil (Hoz)
Buried Resistors: Dielectric thickness: 14 μm
Capacitance /area: 6.4 nF/in2
Breakdown Voltage: >100V
3M material, no need license
Buried Capacitance: Resistance (ohms/sq) : 25, 50, 100, 200
MATERIALS FR-4, Halogen-Free, Rogers, BT, PTFE, PPO, PPE,
Polyimide, Hybrid, Bergquist, Arlon, Taconic and etc.
COPPER PROCESSING 20 oz ,30 oz(Sample)
IMPEDANCE SINGLE&DIFFERENTIAL ±10%,±7.5%,±5%
VIA FILL Vias filled with LPI/hole fill mask Non-conductive
via fill with epoxy hole fill Conductive via fill with copper paste
PRESS FIT ±2mil(0.05mm)
SURFACE FINISHES Electrolytic Ni/Au (Hard & Soft) ENIG
HASL ENIPIG
Immersion Silver Immersion Tin
Reflowed Tin/Lead OSP

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