For more than a decade, Hemeixin has continuously innovated next-generation µVia technologies. As the conventional laser via plating technology reached its limits, Hemeixin High Density Interconnect (HDI) flex circuits can improve electrical performance and consistency by using vias as small as 50 μms or 8-μm copper to increase density in a small electronic package. Innovations in laser µVia drilling, copper plating, direct imaging of resists and masks, and improved registration techniques have helped continually refined Hemeixin's strong production capability.
Flexible printed circuit boards (FPC) are offering the highest level of 3D miniaturization. Very low bending radii in combination with Ultra-HDI (ultra-high density interconnect) are enabling our customers to build increasingly smaller and highly integrated devices. This technology is an enabler of small wearable devices as well as high signal density.
Hemeixin has been a market leader in this field for many years and is manufacturing flex circuits with a layer-count of 1 to 16. We are working with polyimide foils as thin as 12.5 µm (0.5 mil) and adhesive bond plys starting at a thickness of 12.5 µm (0.5 mil). Our state of the art equipment is enabling us to produce FPCs with high output, reliability and repeatability. Depending on the dielectric thickness, laser drilled blind vias can be as small as 35 µm (1.4 mil) in diameter, and can be filled with copper in the subsequent plating process. This plating technology is enabling the use of stacked vias and via-in-pad structures.
High Density Interconnect (HDI) flexible circuits offer increased design, layout and construction options over typical flexible circuits. Each High Density Interconnect incorporates microvias and fine features to achieve highly dense flex circuitry, smaller form factor and increased functionality. This technology offers better electrical performance, access to advanced integrated circuit (IC) package use, and improved reliability.
Cover/substrate: Polyimide film: ½ mil (12μm), 1 mil (25μm), 2 mil (50μm), 3 mil (75μm), 5 mil (125μm); Liquid Photoimageable Coverlay (LPI)
Conductor: Copper: 1/8 oz. (5μm), 1/4 oz. (9μm), 1/3 oz. (12μm), 1/2 oz. (18μm), 1 oz. (35μm), 2 oz. (71μm), 3 oz. (107μm)
Stiffener: Epoxy-glass (FR-4), polyimide-glass, polyimide, copper, aluminum.
Hemeixin core competence lies in the production of highly complex HDI, high-frequency and high-reliability circuit boards for medical,defense, aerospace, industrial and semiconductor applications.
Due to long-term dedication and expertise, Hemeixin has earned a solid reputation for being a technology leader and the partner of choice for providing leading flex, rigid-flex and rigid ultra-HDI/microvia circuit boards solutions - custom tailored to the corresponding requirements.