HDI flex pcb  manufacturer


For more than a decade, Hemeixin has continuously innovated next-generation µVia technologies. As the conventional laser via plating technology reached its limits, Hemeixin High Density Interconnect (HDI) flex circuits can improve electrical performance and consistency by using vias as small as 50 μms or 8-μm copper to increase density in a small electronic package. Innovations in laser µVia drilling, copper plating, direct imaging of resists and masks, and improved registration techniques have helped continually refined Hemeixin's strong production capability.

Flexible printed circuit boards (FPC) are offering the highest level of 3D miniaturization. Very low bending radii in combination with Ultra-HDI (ultra-high density interconnect) are enabling our customers to build increasingly smaller and highly integrated devices. This technology is an enabler of small wearable devices as well as high signal density.

Hemeixin has been a market leader in this field for many years and is manufacturing flex circuits with a layer-count of 1 to 16. We are working with polyimide foils as thin as 12.5 µm (0.5 mil) and adhesive bond plys starting at a thickness of 12.5 µm (0.5 mil). Our state of the art equipment is enabling us to produce FPCs with high output, reliability and repeatability. Depending on the dielectric thickness, laser drilled blind vias can be as small as 35 µm (1.4 mil) in diameter, and can be filled with copper in the subsequent plating process. This plating technology is enabling the use of stacked vias and via-in-pad structures.

Why HDI Flex PCB

High Density Interconnect (HDI) flexible circuits offer increased design, layout and construction options over typical flexible circuits. Each High Density Interconnect incorporates microvias and fine features to achieve highly dense flex circuitry, smaller form factor and increased functionality. This technology offers better electrical performance, access to advanced integrated circuit (IC) package use, and improved reliability.

  • Lower cost and smaller size—increased circuit density can eliminate extra layers and save up to 40% compared to non-HDI designs.
  • Use advanced component packaging—high-I/O and fine-pitch feature capabilities possible with HDI.
  • More design options and flexibility—blind and buried microvias allow for conductor routing on the internal layers under vias, creating more usable design space per layer.
  • Improved electrical performance and signal integrity— microvias in high-speed circuits improve electrical performance by allowing shorter circuit paths, stub reduction and lower cross talk and noise.
  • Improved thermal performance and reliability— microvias lower the z-axis thermal stresses between adjacent layers.
  • Improved cost effectiveness—Hemeixinpcb’s 18” x 24” (45.7 cm x 61 cm) panel size maximizes panel density to increase the efficiency of your assembly process

HDI flex PCB Capability overview

  • Layers count from 3-16 layers
  • Minimum microvia size: 75 μm, 50 μm finished
  • Minimum microvia pad size: via diameter +150 μms
  • Minimum line and spacing: 50 μm Microvia blind plating aspect ratio (depth to diameter): 1:1
  • Minimum core dielectric thickness: 25 μm
  • Minimum copper thickness: 9 μm
  • Blind & buried via construction: sequential build technology
  • Via fill: copper via fill available

kapton flexible pcb Materials:

Cover/substrate: Polyimide film: ½ mil (12μm), 1 mil (25μm), 2 mil (50μm), 3 mil (75μm), 5 mil (125μm); Liquid Photoimageable Coverlay (LPI)

Conductor: Copper: 1/8 oz. (5μm), 1/4 oz. (9μm), 1/3 oz. (12μm), 1/2 oz. (18μm), 1 oz. (35μm), 2 oz. (71μm), 3 oz. (107μm)

Stiffener: Epoxy-glass (FR-4), polyimide-glass, polyimide, copper, aluminum.

Surface finishes include:

  • OSP
  • Immersion Silver
  • Immersion Tin
  • Electroplated Nickel Gold
  • ENIG
HDI fine line pcb

Laser Direct Imaging:

  • 25 μm line width capability
  • ±12 μm registration accuracy
  • Class 1,000 clean room environment

Copper Plating:

  • 12:1 thru-hole plating aspect ratio
  • 1:1 blind microvia aspect ratio
  • Thin material transport system
HDI flex pcb

Automated Optical Inspection:

  • 45 μm etched feature inspection
  • Sensitive to part to part irregularity

HDI FLEX PCB Technological Highlights:

  • Turnkey flex solutions targeting 3D miniaturization
  • Highly reliable, extremely robust multilayer flex/microvia substrates
  • Ultra-thin base materials
  • Filled via and stacked via process available
  • Complex mechanical/assembly assist features, including special profiles, fold lines, cut-outs and thinned bending zones/cavities
  • Wrap-around boards
  • Chip-on-flex (COF), chip scale packaging (CSP) substrates, and BGAs
  • A wide variety of surface finishes, for example; OSP, ENIG, ENEPIG, E-AU, DIG
  • Flying leads
  • Bending test for flexible circuits
  • Ultra-fine line flex cables

Hemeixin core competence lies in the production of highly complex HDI, high-frequency and high-reliability circuit boards for medical,defense, aerospace, industrial and semiconductor applications.

Due to long-term dedication and expertise, Hemeixin has earned a solid reputation for being a technology leader and the partner of choice for providing leading flex, rigid-flex and rigid ultra-HDI/microvia circuit boards solutions - custom tailored to the corresponding requirements.

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