Rigid-flex & flex Capabilities


When you work with Hemeixinpcb, you receive our knowledge and experience, resulting in high quality printed circuit boards. Learn more about our Rigid flex&flex capabilities below.

MANUFACTURING ODB++(preferred)
FORMATS HPGL DXF
Gerber 274X
Excellon
MAXIMUM PANEL SIZE 20″X 80″(500mm X 2000mm)
BOARD THICKNESS min≥2mil(0.05mm)
max≤94.5mil(2.4mm),
LAYER COUNT 2~20 Layer
ASPECT RATIO 16:1
FINISHED HOLE SIZE 6mil (0.15mm) Mechanical Drill
4mil (0.10mm) Laser Drill
LINE WIDTH/SPACE 2mil/2mil (Hoz),
STIFFENER TYPE PI stiffener, FR4 stiffener
SHIEDING MATERIAL Shielding film,
Silver Based Polymer Thick Film Ink
IMPEDANCE ±10%
SINGLE&DIFFERENTIAL
SURFACE FINISHES ENIG ENIPIG
HASL
OSP Immersion Silver

PCB Quote Online

Calculate

Contact us

  • Email:
    This email address is being protected from spambots. You need JavaScript enabled to view it.
Copyright © 2021 Hemeixin Electronics Co, Ltd. All Rights Reserved.