Rigid-Flex PCB Technology

  • New

Micro vias HDI rigid-flex circuit boards technologies include blind and/or buried vias processes and often micro vias with a higher circuitry density than traditional PCB’s. Integrating HDI PCB Technologies with Rigid-flex PCB and HDI PCB. Every Layer Interconnect(ELIC HDI PCB) & Rigid-flex PCB are now available at Hemeixin Electronics Co., Ltd.

Rigid-Flex PCB Technology

HDI PCB Boards contain blind and/or buried vias and often contain micro vias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

There are 6 different types of HDI PCB boards, through vias from the surface to surface, with buried vias and through vias, two or more HDI PCB layer with through vias, a passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

Rigid-Flex PCB Technology:

lMulti-layer HDI (high-density interconnect)/micro vias rigid-flex circuit boards for 3D-miniaturization

sequential, parallel, symmetric and asymmetric build-ups

High-frequency, high-temperature, and ruggedized rigid-flex solutions

high-frequency rigid-flex HDI solutions based on LCP (liquid crystal polymer) base material

Thinned bending zones

the high variety of flex and rigid base materials, surface protection and surface finishes.

Polyimide rigid-flex circuits Capabilities:

  • Lines/spaces:35/40 µm
  • micro vias/pads diameter (flex):50/200 µm
  • micro vias/pad diameter (rigid, laser):75/200 µm
  • Through vias/pads diameter (rigid, mech.):125/300 µm
  • Thinnest dielectric thickness (flex):12 µm
  • Thinnest dielectric thickness (rigid):60 µm
  • Conductor width tolerance:+/- 20%
  • Artwork to solder mask tolerance:+/- 50 µm
  • Layer count up to 20

Advanced rigid-flex circuits PCB techniques

  • Lines/spaces:25/35 µm
  • micro vias/pads diameter (flex):40/100 µm
  • micro vias/pads diameter (rigid, laser):50/150 µm
  • Thinnest dielectric thickness (flex):12 µm
  • Thinnest dielectric thickness (rigid):46 µm
  • Conductor width tolerance:+/- 15%
  • Artwork to solder mask tolerance:+/- 25 µm
  • Layer count up to 24

Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another.

The proper application of Rigid-Flex circuit boards offers optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components.

Additional advantages of Rigid-Flex circuit boards are dynamic and mechanical stability, the resulting 3-dimensional freedom of design, simplified installation, space savings, and maintenance of uniform electrical characteristics.

Welcome you to contact our sales email by This email address is being protected from spambots. You need JavaScript enabled to view it..

Calculate
Contact us
  • Email:
    This email address is being protected from spambots. You need JavaScript enabled to view it.
Copyright © 2022 Hemeixin Electronics Co, Ltd. All Rights Reserved.