Rigid PCB

Rigid PCB


Product design, system speed requirements, microprocessors, and component scaling, and increased thermal performance are driving advances in PCB technology every day. Hemeixin’s technical and production capability and aggressive technology roadmap has kept pace with these changes and provides a scalable platform for growth.
Rigid PCB
Raw Card J0 with embedded resistors
  • Layers (2-64)
  • Lines and Spaces (Volume 3/3 Prototype 2/2)
  • Glass epoxy (GF) laminate, Tg – 180ºc Epoxy (IT180A, FR370HR etc)
  • Polyamide (GI) laminate (35N, NELCO7000, VT901 etc)
  • Thermount (BI, aramid) epoxy and polyamide base (85NT etc)
  • BT/Epoxy (GMN)
  • Teflon base with Aluminum or brass backing
  • Low Dk FR4: (FR408HR, MEGATRON6,MEGATRON7, ISPEED ISOLA, NELCO 4000-13 SI)
  • Rogers 6000, Rogers 4000, Rogers 3000
  • Controlled Impedance (±10% Standard – ±5% Advanced)
  • Blind and Buried Vias; Filled via capability
  • Buried Capacitance&Buried Resistor
  • Resistance (ohms/sq.) : 25, 50, 100, 200
  • Advanced thermal management and embedded coin technology
  • High Performance and Emerging Materials; Halogen free,low loss,ultra-thin,mixed packages, inlay
  • Sequential Lamination
  • High Tech Drilling Capability – Small hole drilling, Backdrilling
  • Mechanical depth control drilling with ±10um tolerance,min drill size 0.15mm
  • Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)

Solution