IC Substrate
IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing. Flip Chip technology is the foundation for packaging high performance Integrated Circuits used in applications from consumer-level smartphones, tablets and PCs to high-performance graphics workstations, servers and IT infrastructure equipment. IC substrates serve as the connection between the IC chip(s) and the PCB through a conductive network of traces and holes.
Advanced technology that is shaping the future. Hemeixinpcb produces many types of IC substrates on which IC chip(s) are attached to the IC substrate utilizing wire bonding and, or flip-chip methods. Our IC substrates that Hemeixinpcb manufacturers include:
- CSP (Chip Scale Packages)
- FC-CSP (Flip Chip) CSP
- BOC (Board on Chip)
- PoP (Package on Package)
- PiP (Package in Package)
- SiP (System in Package)
- RF Module
- LED Package
Capabilities:
- Layer count : 1L / 2L / 3L / 4L , etc.
- Minimum line width and spacing: 15/15 µm
- Minimum laser via/pad: 45/95 µm
- Impedance control for critical signal traces
- RoHS compliance materials
- Bump pad: minimum 140 µm bump pitch
- Structure: any layer, coreless, cavity, embedded passive, Embedded trace (down to 20 um pitch)
- Wide material and surface finish options available
- Thickness: 100 um (1.5L) ~ 225 um (5L)
- Smallest Package Size: 3 x 3 mm up to 15 x 15 mm
Applications:
- Hand-held, Mobile, Networking
- Smart phone, Consumer electronics and DTV
- CPU, GPU and Chipset for PC application
- CPU, GPU for Game Console (eg. X-Box, PS3, Wii…)
- DTV Chip Controller, Blu-Ray Chip Controller
- Infrastructure application (eg. Network, Base Station…)
- ASICs
- Digital Baseband
- Power Management
- Graphic Processor
- Multimedia Controller
- Application Processor
- Memory card for 3C products (eg. Mobile/DSC/PDA/GPS/Pocket PC/NoteBook)
- High Performance CPU
- GPU, ASIC Devices
- Desktop / Server
- Networking
- Game Console
