IC Substrate

IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing. Flip Chip technology is the foundation for packaging high performance Integrated Circuits used in applications from consumer-level smartphones, tablets and PCs to high-performance graphics workstations, servers and IT infrastructure equipment. IC substrates serve as the connection between the IC chip(s) and the PCB through a conductive network of traces and holes.

Advanced technology that is shaping the future. Hemeixinpcb produces many types of IC substrates on which IC chip(s) are attached to the IC substrate utilizing wire bonding and, or flip-chip methods. Our IC substrates that Hemeixinpcb manufacturers include:

CSP (Chip Scale Packages)
FC-CSP (Flip Chip) CSP
BOC (Board on Chip)
PoP (Package on Package)
PiP (Package in Package)
SiP (System in Package)
RF Module
LED Package

Capabilities:

Layer count : 1L / 2L / 3L / 4L , etc.
Minimum line width and spacing: 15/15 µm
Minimum laser via/pad: 45/95 µm
Impedance control for critical signal traces
RoHS compliance materials
Bump pad: minimum 140 µm bump pitch
Structure: any layer, coreless, cavity, embedded passive, Embedded trace (down to 20 um pitch)
Wide material and surface finish options available
Thickness: 100 um (1.5L) ~ 225 um (5L)
Smallest Package Size: 3 x 3 mm up to 15 x 15 mm