IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing. Flip Chip technology is the foundation for packaging high performance Integrated Circuits used in applications from consumer-level smartphones, tablets and PCs to high-performance graphics workstations, servers and IT infrastructure equipment. IC substrates serve as the connection between the IC chip(s) and the PCB through a conductive network of traces and holes.
Advanced technology that is shaping the future. Hemeixinpcb produces many types of IC substrates on which IC chip(s) are attached to the IC substrate utilizing wire bonding and, or flip-chip methods. Our IC substrates that Hemeixinpcb manufacturers include: