Manufacturing Capabilities

Manufacturing Capabilities


When you work with Hemeixinpcb, you receive our knowledge and experience, resulting in high quality printed circuit boards. Learn more about our pcb capabilities below.

MANUFACTURING FORMATS ODB++,HPGL DXF ,Gerber 274X ,Excellon
MAXIMUM PANEL SIZE 48″X 24″(1200mm X 610mm)
MAXIMUM THICKNESS 394 mil(10mm),Samples of 689mil(17.5mm)
LAYER COUNT 2~58 Layer,68-Layer for Samples
INTERCONNECT FORMATION TYPES Back Drilled Blind (laser & mechanical)
Dual Diameter Electrically Isolated Thru Hole Buried SMT
ASPECT RATIO 16 : 1
FINISHED HOLE SIZE 6mil (0.15mm) Mechanical Drill
3mil (0.075mm) Laser Drill
BLIND VIA ASPECT RATIO 1.25 : 1
INTERNAL FEATURES Inner Layer: 2mil/2mil (Hoz),
Outer Layer: 3mil/2mil (Hoz),
EXTERNAL FEATURES Inner Layer: 3mil/2mil (Hoz),
Outer Layer: 3mil/3mil (Hoz)
Buried Resistors: Dielectric thickness: 14 μm
Capacitance /area: 6.4 nF/in2
Breakdown Voltage: >100V
3M material, no need license
Buried Capacitance: Resistance (ohms/sq) : 25, 50, 100, 200
MATERIALS FR-4, Halogen-Free, Rogers, BT, PTFE, PPO, PPE,
Polyimide, Hybrid, Bergquist, Arlon, Taconic and etc.
COPPER PROCESSING 20 oz ,30 oz(Sample)
IMPEDANCE SINGLE&DIFFERENTIAL ±10%,±7.5%,±5%
VIA FILL Vias filled with LPI/hole fill mask Non-conductive
via fill with epoxy hole fill Conductive via fill with copper paste
PRESS FIT ±2mil(0.05mm)
SURFACE FINISHES Electrolytic Ni/Au (Hard & Soft) ENIG
HASL       ENIPIG
Immersion Silver      Immersion Tin
Reflowed Tin/Lead       OSP