High-Density Interconnect (HDI) PCBs are becoming more and more popular as layout engineers seek to make the most of the limited board in the electronics industry. The popularity of HDI technology ...

Routing PCBs is an integral part of any PCB design. The layout and design should be done carefully and patiently to get the optimum result. Routing a PCB is a difficult task, not only because routi...

When it comes to flex PCB design, several factors affect flex PCB design. These factors include the material used for the substrate, the trace width and spacing, thickness of copper, number of laye...

The use of microvia technology has contributed to the miniaturization of PCBs and allowed engineers to become more creative with their designs. The world of integrated circuits would not be possibl...

The manufacturing process for HDI and regular PCB boards have key differences that are worth exploring. For starters, HDI boards use more layers, smaller microvias, thinner traces, and other compo...

High density pcb and high-speed board require the best quality of PCB material to ensure the device's performance. The need for PCB material that can support high-speed connections and high density...

The 5G revolution is here, and wireless technology is the future. Many new uses for wireless broadband are being explored across industrial, medical, and consumer applications. The broad adoption o...

Which board do you use to manufacture your PCBs: FR-4 or Megtron 6? FR-4 is the traditional material. It is used for standard and high-frequency circuit boards. FR-4 PCBs are more resistant to heat...

Flex circuits are becoming more popular among PCB designers and are the new go-to for circuit designs. Flex PCB manufacturers can offer a PCB that relies on a flexible substrate, making it bendable...

The placement of your components plays one of the most critical roles in creating a working board while designing an HDI PCB to run electrical signals. Placing components in the wrong place can mak...

Blind vias are used to increase the pad density and wiring of a high density interconnect circuit. Designers often combine blind vias with buried vias and microvias to implement their designs witho...

High density interconnect PCBs were first innovated in the 1980s when researchers investigated ways of reducing the size of vias. The first HDI PCB was commercially available in 1984 with the Hewle...