What is ELIC PCB?

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If you are a PCB designer, then you have probably heard of ELIC PCB. But what is it, and what can it do for your design? ELIC PCB is an Every Layer Interconnect Printed Circuit Board that you can quickly and easily embed into your design. It eliminates the need for vias, resulting in a more compact and straightforward layout. Plus, it delivers high performance and reliability due to its shorter signal paths. So if you are looking for a high-quality embedded PCB solution, ELIC PCB is worth considering!


Every Layer Interconnect (ELIC) is an advanced type of printed circuit board (PCB) that helps to improve the performance of electrical and electronic systems. ELICs have better signal integrity and higher reliability than traditional PCBs. They are also more flexible and can be used in various applications.

ELICs are composed of multiple conductive material layers, separated by insulating layers. Depending on the application, the number of layers can vary from two to eight. The conductive materials used in ELICs include copper, aluminum, and silver. The insulating materials used include polyimide, FR4, and Rogers.

Manufacturing Process of ELIC PCB

The Every Layer Interconnect (ELIC) is a printed circuit board that offers several advantages over traditional PCBs. ELICs are composed of multiple layers of interconnecting material, which allows for greater flexibility in the routing of circuitry. This results in a smaller overall footprint for the board and reduces crosstalk and other signal integrity issues.

ELICs are typically manufactured using a process known as sequential lamination, which involves bonding together multiple layers of material using heat and pressure. This article will provide an overview of the sequential lamination process and some challenges associated with manufacturing ELIC PCBs.

Creating Stack

The first step in the sequential lamination process is to create a stack of the individual layers that will make up the ELIC PCB. The number of layers in an ELIC PCB can range from two to eight, although four or six-layer boards are most common. Each stack layer is composed of a different material, a dielectric or a conductor. Once the stack is created, it is placed in a lamination press.


The lamination press applies heat and pressure to the stack, which bonds the individual layers together. The amount of heat and pressure applied depends on the materials used. For example, dielectric materials require less heat and pressure than conductive materials. The lamination process is typically completed in less than one hour.


Once the ELIC PCB has been laminated, it is ready for etching. The etching removes unwanted material from the board and creates the desired circuit patterns. Etching is typically done using a chemical solution, which is applied to the board using a stencil. The stencil contains the designs for the desired circuitry, and the chemical solution etches away the exposed areas of the board.


The final step in the manufacturing process is to apply a finish to the ELIC PCB. The most common finishes are solder masks and coverlay. A solder mask is a thin layer of polymer on the board's top and bottom. Coverlay is a thin layer of adhesive applied to the top of the board. Both finishes serve to protect the circuitry from damage and contamination.

Benefits of ELIC PCB

Every Layer Interconnect (ELIC) is a printed circuit board (PCB) type that offers many advantages over traditional PCBs. ELIC PCBs are becoming increasingly popular due to their improved signal integrity, electrical performance, crosstalk reduction, noise reduction, increased density, enhanced bandwidth, and reliability. Let's take a closer look at each of these benefits:

Improved Signal Integrity

ELIC PCBs feature a unique construction that allows signals to be routed on multiple layers, resulting in improved signal integrity. This is especially beneficial for high-speed and high-frequency applications.

Better Electrical Performance

ELIC PCBs offer better electrical performance due to their improved signal integrity. This results in reduced crosstalk, lower noise, and increased density.

Reduced Crosstalk

Crosstalk is a phenomenon that occurs when two or more signals interfere with each other. Improved signal integrity in ELIC PCB reduces the crosstalk.

Lower Noise

ELIC PCBs help in lowering unwanted noise. This is beneficial for high-speed and high-frequency applications.

Increased Density

ELIC PCBs allow more signals to be routed on a single board, leading to increased density. This is especially beneficial for applications requiring many signals to be routed.

Enhanced Bandwidth

ELIC PCBs also enhance signal bandwidth, making them ideal for HF applications without interruptions.

More Reliable

ELIC PCBs are more reliable compared to other PCBs. These characteristics make them useful for mission-critical applications.

ELIC PCBs offer many advantages over traditional PCBs. If you're looking for any of the discussed above, then an ELIC PCB may be the right choice for your application.

Challenges Associated with ELIC PCBs

 Every Layer Interconnect (ELIC) printed circuit boards (PCBs) are advanced PCBs that offer many benefits over traditional PCBs. However, there are also some challenges associated with ELIC PCBs that should be considered before using them.

High Cost

One challenge is the high cost of ELIC PCBs. They are generally more expensive than traditional PCBs because they are more challenging to manufacture.

Difficult to Manufacture

Another challenge associated with ELIC PCBs is that they can be more difficult to work with. This is because each Layer of an ELIC PCB is interconnected, making it more challenging to trace signals and schematics.

Requires Special Equipment and Expertise

Additionally, ELIC PCBs often require special software and tools to be appropriately designed and manufactured. ELIC PCBs can be delicate and susceptible to damage. This is due to the thin traces and tight spacing between layers. As a result, extra care must be taken when handling and assembling ELIC PCBs.

Overall, ELIC PCBs offer many benefits over traditional PCBs. However, there are also some challenges that you should consider before using them. Considering ELIC PCBs, carefully weigh the pros and cons to ensure they are the right choice for your project.

Wrapping Up

ELIC PCBs offer several advantages over traditional PCBs, including a smaller overall footprint, reduced crosstalk, and improved signal integrity. However, manufacturing ELIC PCBs can be challenging due to the need for precise alignment of the layers during the lamination process.

In addition, the etching process is more complex than traditional PCBs, and the thinness of the materials used in ELIC PCBs can make them susceptible to damage during handling. Despite these challenges, ELIC PCBs are becoming increasingly popular for many applications.

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