Megtron 4, Megtron 6 and Rogers RO4350B High Speed, Low Loss Materials' Instruction

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With so many PCBs available today, choosing the right one can be difficult. Read on to know the benefits and features of some of the leading PCBs on the market.

Single-sided printed circuit boards (PCBs):
This is the most fundamental of all PCBS. There is only one layer of substrate and one layer of copper or any other metal in them. The conductors are only on one side of the PCB's dielectric foundation. Simple circuits, such as sensors and electrical toys, are made with them.


PCBs with two sides:
A metal layer covers both sides of the substrate on double-sided PCBs. Holes are bored in the board to enable for the attachment of the pieces as well as the interconnection of the plates. These PCBs are utilized in a variety of applications, including as mobile phones and amplifiers.


PCBs with several layers:
PCBs with more than two layers of copper are known as multi-layer PCBs. The layers are separated by many layers of substrate and insulating materials. Pads, also known as PTH, link these layers (plated through holes).


Lead-free Compatible Megtron 4 PCB Multilayer Materials with High Speed and Low Loss

MEGTRON 4/4S is intended for applications with low Dk and high Tg, such as network equipment, servers, routers, and measurement instruments. Low dielectric constant and dielectric dissipation factor (Dk = 3.8 and Df =.005 At 1GHz), Lead-Free soldering, RoHS compliance, and High Heat Resistance are the major features of MEGTRON 4/4S.

MEGTRON 4S is a better-than-MEGTRON 4 with a higher Tg, making it ideal for multi-lamination cycles and hybrid constructions. MEGTRON 4/4S complies with IPC 4101 /91 /102.


R-5725 / R-5725S / R-5725 / R-5725 / R-5725

R-5620 / R-5620S R-5620 / R-5620S R-5620 / R-5



(@ 1GHz) Low Dk = 3.8, Low Df = 0.005.

Low transmission loss of less than 50% compared to standard FR-4

Excellent through-hole dependability

Soldering that is lead-free and compatible with the RoHS directive

Heat resistance is high

Megtron 6 PCB - Multi-layer Materials with High Speed and Low Loss

MEGTRON 6/6G is a high-performance material for high-speed networks, IC teseters, high-frequency measurement devices, and mainframes. Dielectric and low-dielectric constant dissipation factors, along with low transmission losses, and high levels of heat resistance are the major characteristics of MEGTRON 6/6G; Td = 410°C (770°F). MEGTRON 6/6G complies with IPC 4101 /102 /91.


Megtron 6 is a popular, high-speed laminate material used in different types of PCB fabrication and manufacturing for many applications. This advanced basic material is designed for many different high-frequency measuring instruments, integrated circuit (IC) testers and mainframes. Megtron 6 has a low transmission loss, thick layer count and many different layers that enhance high-speed network equipment.

These laminates have electrical properties that rival Polytetrafluoroethylene (PTFE) materials, thanks to their high processability and unique benefits. Using Megtron 6 laminates enhances your system performance in many different fields, including computing, telecommunications, high-speed transfer and router applications. Megtron 6 sheets also have a low dielectric constant, high thermal resistance, high-density interconnect (HDI) and increased stability.

Additionally, they’re also compatible with lead-free soldering and can even prevent signal reflections at high frequencies with low-profile foils for radio frequency printed circuit boards. To manufacture Megtron 6 laminates, both conducting materials (mainly copper) and insulating materials (usually fiberglass epoxy materials) are used.

Now that we have a brief overview of some Megtron 6 features, let’s look at the main attributes that help distinguish this material from other Panasonic Megtron laminates.

Low Dielectric Dissipation Factors (Df)

Low dielectric dissipation factors (Df) indicate how well a material can act as an insulating material or hold energy. The lower the dissipation factor, such as in Megtron 6 laminates, the better and more efficient the insulator system behaves. Megtron 6 laminates carry these low dissipation factors, sitting at 0.002, providing minimal leakage of electric currents during its operations.

Low Dielectric Constants (Dk)

Low dielectric constants (Dk) are ideal for power and high-frequency applications because they help minimize electric power loss. Megtron 6 laminates have some of the best properties to help increase electrical conductivity. With a dielectric constant of 3.7, they have little storage of current, making them ideal for such applications.

Low Transmission Loss

Many PCBs require low transmission loss materials to help reduce the dielectric and conductor loss, which is required to achieve the demand for PCB materials. Luckily, Megtron 6 laminates have low transmission loss, making them ideal for these applications.

High Resistance to Heat

Megtron 6 laminates can withstand high heat thanks to their dissipation features. You can be confident in using these sheets for applications in extreme temperatures, or even with thermal clads, without creating a dangerous environment or damaging your surfaces.


Here’s a better look at how you might use Megtron 6 laminates and the applications they’re best suited for:

  • High-frequency measuring equipment: Panasonic Megtron 6 laminates are the ideal choice when operating this type of equipment. They can offer the most accurate results every time.
  • High-speed network equipment: You can use Megtron 6 laminates for communication equipment because it helps improve operations on devices for local area networks and interconnect routing.
  • High-speed mainframes: High-speed mainframes, or computer systems that help process large amounts of data, can benefit from Megatron 6 laminates because they help increase the efficiency of the devices by maintaining the overall system and keeping it running in optimal operating conditions.
  • High-speed IC testers: The mechanical properties of Megtron 6 laminates helps IC testers provide the most efficient, accurate results while testing other types of ICs.





(@ 1GHz) Low Dk = 3.7, Low Df = 0.002.

Through-hole dependability is exceptional (5x better than our conventional high Tg FR4 material)

Soldering that is lead-free and compatible with the RoHS directive

Heat resistance is high.

Rogers’ RO4350B

RO4350B laminates use the same manufacturing procedure as normal epoxy/glass laminates to give tight control over dielectric constant (Dk) and minimal loss. RO4350B laminates are less expensive than traditional microwave laminates and do not require the same through-hole treatments or handling procedures as PTFE-based materials. For active devices and high-power RF designs, these materials are UL 94 V-0 qualified.

The RO4350B hydrocarbon ceramic laminate from Rogers has been developed for high-frequency, low cost applications. The laminate can be fabricated into printed circuit boards using standard FR-4 circuit board processing techniques. Unlike PTFE based high performance materials, this series of laminates do not require specialized via preparation processes such as sodium etch. This material is a rigid, thermoset laminate that is capable of being processed by automated handling systems and scrubbing equipment used for copper surface preparation.

The RO4350B laminate has a Dk of 3.48, Df of 0.0031 to 0.0037 and can be used up to frequencies of up to 40 GHz. It can be used to develop RF & microwave circuits, matching networks and controlled impedance transmission lines.

3.48 dk +/- 0.05 dk

At 10 GHz, the dissipation factor is 0.0037.

At 32 ppm/°C, the Z-axis coefficient of thermal expansion is low.

Low-cost manufacturing processes such as FR-4

A reasonable price

Dimensional stability is excellent

Wire-saving and compact size

Rogers Ro4350b Product Specifications

Part Number RO4350B
Manufacturer Rogers Corporation
Description High Frequency, Low Cost Ceramic Laminates to Replace FR-4
Dk (Dielectric Constant) 3.48
Df (Dissipation Factor) 0.0031 to 0.0037
Td 390 Degrees C
Tg Greater than 280 Degree C
Thickness Inches *0.004” (0.101mm), 0.0066” (0.168mm) 0.010” (0.254mm), 0.0133” (0.338mm), 0.0166” (0.422mm), 0.020”(0.508mm), 0.030” (0.762mm), 0.060”(1.524mm)
Electrical Strength 31.2 KV/mm, 780 V/mm
Flamibility V-0
Peel Strength 0.88 N/mm (5.0) pli
Weight 12” X 18” (305 X457 mm), 24” X 18” (610 X 457 mm), 24” X 36” (610 X 915 mm), 48” X 36” (1.224 m X 915 mm)

Thermal Coeffecient
16 ppm/°C
Thermal Conductivity 0.71 W/m/K


Benefits of PCB:

Increased number of components:
PCBs have the ability to house a high number of components. Because these components are likely to be quite tiny, wire would be hard to link them all. PCBs not only assist to link all of these components, but they also allow for the use of copper tracks rather of wires, making it easier to hold small components and conserving wire. In addition, a tiny circuit board may accommodate a great number of components, making it compact. As a result, huge circuit designs and sophisticated circuits may be compacted to save space.

Easier and quicker repairing:
It is fairly simple to fix your PCB if it is not working properly. This is because all of the polarities are silkscreened into the board, making it very straightforward to verify and fix the components. This not only makes the building more convenient, but it also makes the repair procedure easier.

Time management:
The traditional process of creating circuit boards takes a long time. Printed circuit boards, on the other hand, not only save time but are also more convenient.

The elements are in place:
All of the components are soldered onto the circuit boards during the assembly process, securing them in place. This is accomplished by using solder flux, which prevents any movement that may dislodge the components.

Short circuits are less likely:

Copper rails or conductive metal are used to make all of the connections. As a consequence, there's less danger of any loose connections causing the board to short-circuit.

Electronic noise is minimal to non-existent:
The PCBs are constructed in such a way that electronic noise is minimal to non-existent. Any noise is converted to heat or radiation and then discharged. There are no sounds on a well set out PCB. This is due to the components being structured in such a way that route lengths are kept to a minimum, resulting in less radiation and EM waves.

Less expensive:
Because most PCBs are manufactured using automated techniques, you may save the schematic design layout and reuse it as needed. As a result, you may save time and money by producing many batches of identical PCBs at the same time.

Increased reliability:
PCBs have been shown to be quite dependable. They are thoroughly scrutinized for mistakes throughout the construction and production process. The entire process is totally automated, resulting in a more dependable output.


High-frequency PCB materials, therefore, need a tight tolerance for dielectric constant, a low thermal coefficient of dielectric constant, a stable dielectric constant over frequency, and a low z-axis CTE.

While there are several high-frequency circuit materials available in the market, only a select few fit all the above requirements.

PCB fabricators use the following materials for building high-frequency PCBs:

FR4, 370HR, FR408HR, Rogers 4350 series, Rogers 4003 series,

High-speed material: Tachyon, Megtron series

Their high-frequency characteristics are as follows:

Material Dielectric Constant Loss Tangent CTE Z-Axis Frequency
FR4 3.8 – 4.8 0.0160 175 < 1 GHz
370HR 3.92 0.0250 45 100 MHz to 10 GHz
FR408HR  3.39 0.0095 55 1 GHz to 10 GHz
Rogers 4350B 3.48 0.0031 32 2.5 GHz to 40 GHz
Rogers 4003C 3.38 0.0021 46 2.5 GHz to 40 GHz
Tachyon 100G 3.02 0.0021 15 2 GHz to 40 GHz, data rate > 100 Gb/s
Megtron 6 3.4 0.0020 45 2 GHz to 10 GHz


PCB design at the fabricator begins with an insulating substrate, and they typically use FR4 as its core. The FR in the name refers to the flame retardant properties of the material, while type 4 represents the woven glass-reinforced epoxy laminate in the substrate. FR4 is highly insulating and rigid, and the laminate typically forms the base material for the PCB.

To successfully design RF PCBs on an FR4 laminate, it is necessary to understand its material properties. This includes the dielectric and thermal properties. When using standard FR4 for RF applications, its dielectric stability may not be consistent across higher frequencies. FR4 also has a higher dissipation factor and higher insertion loss at microwave frequencies, leading to larger attenuation at high frequencies. Most fabricators use high-performance FR4 for circumventing these problems with RF circuits.


370HR is a high-performance FR4 material from ISOLA. Compared to the regular FR4 material, 370HR has advanced properties such as better dielectric and thermal properties, along with higher CAF resistance and UV blocking. Made from E-glass fabric reinforced with multifunctional epoxy resins, 370HR has low CTE and high Tg, while retaining the processability of FR4.

As the mechanical and thermal performance of 370HR exceeds that of the traditional FR4 material, its design is specially formulated for multilayer high-performing PCB applications.


Using E-glass fabric reinforced with ISOLA’s patented high-performance multifunctional resin system, the FR408HR laminates offer over 30% improvement in z-axis expansion, while offering more than 24% electrical bandwidth compared to competitive products. The superior moisture resistance at reflow helps to bridge the gap from both electrical and thermal perspectives.

Reinforcing with E-grade glass fabric allows the high-performance multifunctional resin system in FR408HR to offer a low dielectric constant of 3.39. This allows wider trace widths and reduces the skew caused by the difference in dielectric constant between glass and resin.


Designed for performance, the RO4000 series materials are made of reinforced hydrocarbon/ceramic laminates rather than PTFE. With low dielectric tolerances and low loss factor, the RO4000 material offers excellent electrical performance at higher operating frequencies. Their stable electrical properties versus frequency make the RO4000 series ideal for broadband applications.


Designed for very high-speed digital applications, the Tachyon 100G lamination materials allow speeds up to and beyond 100 Gb/s. Exhibiting exceptionally stable electrical properties over a broad frequency and temperature range, Tachyon 100G laminates are suitable for upgrading existing products to the next generation. The low z-axis CTE allows using Tachyon 100G materials in high-layer count PCBs with multiple 2 oz planes and for use with BGAs of pitch 0.8 mm or lower.

Tachyon 100G materials use spread glass and copper with reduced profile to improve rise times, mitigate skew, and reduce jitter.


This is an advanced material from Panasonic, offering low dielectric constant and low loss substrates for high-speed digital applications. The electrical properties of Megtron 6 laminates are competitive with PTFE-based materials, but with significant improvements in processability. Megtron 6 family of materials offers the designer significant benefits in system performance when used for telecommunications, routers/switching, high-speed computing, and transfer applications.

With the increasing use of PCBs in all areas over the years, it becomes very important to choose the correct PCB material. The right PCB material for an application not only affects the functionality and features, but also the overall cost of the board. Fabricators and designers select the materials on the basis of the application requirement, environmental factors, and most other constraints the PCB will likely encounter.

To sum up, this blog covered some of the key features and advantages of three popular PCBs, along with discussing the general benefits pertaining to Printed Circuit Boards. To learn more about PCBs and how they can help you, please feel free to reach out to us.

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