Hemeixin is one of the first companies to provide volume high density interconnect PCB capability to our customers. Our continuous investment in developing world-class, fine-line Microvia technology has made us a leading Microvia HDI PCB board manufacturer. Our thorough experience and commitment in providing a complete solution for our customers helps to resolve early design issues, shorten the lead time, and deliver a high-quality, cost-efficient product.
|Microvias/pad diameter (laser)||75/200 µm|
|Through vias/pads diameter (mechanical)||150/300 µm|
|Thinnest starting material||50 µm|
|Thinnest dielectric thickness||60 µm|
|Conductor width tolerance||+/- 20%|
|Artwork to soldermask tolerance||+/- 25 µm|
|Layer count||up to 58|
|Microvias/pad diameter (laser)||50/150 µm|
|Through vias/pads diameter (mechanical)||125/250 µm|
|Thinnest starting material||50 µm|
|Thinnest dielectric thickness||50 µm|
|Conductor width tolerance||+/- 15%|
|Artwork to soldermask tolerance||+/- 15 µm|
|Layer count||up to 68|
High density interconnect PCB designs push the limits of technology and Hemeixinpcb is at the forefront of innovation, satisfying the most rigorous requirements.
The demand for HDI PCB manufacturing has been increasing due to the advancements in technology and the many benefits HDI PCBs provide for high-tech applications. Fitting more technology in less space with fewer layers creates limitations for many HDI PCB manufacturing companies that do not have the specialized equipment and the capacity for advanced features, finer lines, and tighter tolerances. HDI printed circuit board designs utilize a combination of advanced features like microvias, blind vias, via-in-pad, along with stacked and staggered vias to maximize the space of the board while increasing its performance and functionality.
Hemeixinpcb achieves high quality and precision with in-house laser drill capabilities that include precise depth control. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features.
In addition to our Microvia HDI PCB manufacturing, we also produce other types. Discover our RF and Microwave PCB, Heavy Copper PCB, Metal Core & Thermal PCB, Manufacturing Capabilities, and IC Substrate pages.
At HemeixinPCB, we’re your one-stop shop for all things PCB, everywhere from manufacturing and assembly, straight down to the final production and speedy delivery.
Whether it’s Rigid PCBs & HDIs, Rigid-Flex & Flex PCBs and HDIs, Electronic Parts’ Kits and Circuit Board Assembly, or Quick Turn PCB, we provide you with the ever-convenient options of either standard, fast, or express delivery. To view our full PCB prototype assembly-delivery services, please visit here.
For further information or enquiries regarding our HDI PCB assembly, production or manufacturing services, or to obtain an online quote for a Rigid PCB, Flex PCB, Rigid-Flex, or Turn-Key PCB, please fill out our online form here or contact us via Skype or email.
We understand how crucial it is for our customers to have technological products that are faster and lighter than their competitors, and as such we are a leading manufacturer of High Density Interconnect PCB.
We are experts in PCB fabrication, especially when it comes to creating miniature components, specialized equipment, and high quality thin materials to use in circuitry. Our facilities strive to stay up to date on the most advanced technologies and equipment in order to produce the best HDI PCB for our clients.
If your product has high speed electrical requirements, such as high-frequency transmission capability, reductions in unnecessary radiation, and impedance control measures, our HDI PCB manufacturing capacity has you covered.
HDI PCB production requires high-density micro-vias, thin lines, and reliable high performing thin materials. While the HDI PCB manufacturing process may be intricate and complex, the results are well worth the investment as the circuit boards’ compactness and decreased weight to conventional counterparts means that the devices are more resistant to physical collision.
This higher density per unit area functionality has resulted in an increase in HDI PCB manufacturing to meet growing demand for use in various fields such as 4g networking, smartphones, computing, and other high-tech applications.
Moreover, advantages to using HDI PCB include increased cost effectiveness, as one HDI circuit board can produce the same functionality that traditionally would have required multiple boards. That is more value, for less!
If your business is looking to use high density interconnect PCB in your products, feel free to contact us any time and send us your specifications for a quote.
Our HDI PCB manufacturing experts can help review your turnkey designs and can consult the best approach to achieve your desired goals.