HDI PCBs: Advanced Design, Manufacturing & Performance Benefits

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What is an HDI PCB? Key Definitions & Types A High Density Interconnect (HDI) PCB is a cutting-edge circuit board distinguished by blind/buried vias, microvias (≤0.006”/150μm diamete...

HDI PCBs: Advantages, Applications & Technical Superiority

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What is an HDI PCB? Core Definition A High-Density Interconnect (HDI) PCB is a advanced circuit board characterized by high pin density (120–160 pins per square inch), dense component placeme...

HDI PCB Design Basics: Manufacturing Process, Materials & DFM Guidelines

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What is HDI PCB? Core Concepts & Standards Definition & Evolution of HDI Technology High Density Interconnect (HDI) PCBs are advanced circuit boards optimized for packing more components ...

A Comprehensive Guide to High-Density Interconnect Technology

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What is HDI PCB? Definition & IPC-2226 Standards Core Definition of High-Density Interconnect PCB Per the IPC-2226 international standard, a High-Density Interconnect (HDI) PCB is a printed c...

Cost and Performance: Skip Via or Blind Via in 12 Layers

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Two critical via types used in HDI PCB design to lower interconnect density, enhance signal integrity, and maximize performance are skip vias and blind vias. Engineers frequently have to choose bet...

Halogen-free FR4 alternatives meeting UL 94 V-0 flammability for automotive applications

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With the increasing emphasis on sustainability, fire safety, and compliance, the demand for halogen-free FR4 alternatives in automotive applications is rapidly growing. Traditional FR4 PCB material...

Cost/Performance Tradeoffs Of Using Skip-Via Vs. Blind-Via In 12-Layer Designs

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When designing complex multilayer PCBs, particularly those with 12 or more layers, via selection plays a critical role in balancing cost, performance, and manufacturability. Two of the most debated...

ENIG vs. ENEPIG PCB Surface Finish

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Choosing the right surface finish in PCB prototyping is a technical detail that can define how smoothly your project moves from design to testing. ENIG (Electroless Nickel Immersion Gold) and ENEPI...

HDI Microvias for 0.3mm Pitch BGA

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Printed circuit board (PCB) designers face increasing challenges in routing dense ball grid arrays (BGAs), especially with pitches as tight as 0.3mm. High-density interconnect (HDI) technology, par...

Breakaway Tab Design Rules For Depaneling 0.4mm-Thick Rigid-Flex Boards

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You need to be extra careful when designing breakaway tabs for 0.4mm-thick rigid-flex PCBs. These boards are thin and flexible, often used in small devices like smartwatches, hearing aids, or compa...

Low Volume PCB Assembly Services

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Low-volume PCB assembly, often called small batch assembly, involves producing a limited number of circuit board assemblies, usually between 25 and 5000. This assembly type is essential for applica...

Desmear Process Optimization for PTFE-Based RF Substrates

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The desmear process is key when making PTFE-based RF circuit boards. PTFE is a special material used in high-frequency circuits because of its great electrical properties. But PTFE has a tough surf...
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