Microvia Design for Manufacturing (DFM) Checklist

| HEMEIXIN | New
Aligned with IPC-2226, IPC-6016, and Industry Fabrication Best Practices 1. Core Microvia Geometry & Aspect Ratio  Finished microvia diameter: 20–150µm (0.8–6 mils) (IPC-2226 definitio...

Microvias in HDI PCB Design: Technical Solutions for High-Density Interconnect Challenges

| HEMEIXIN | New
The exponential growth of semiconductor integration—smaller dies, higher I/O counts (exceeding 1,000 pins for advanced BGAs/ASICs), and finer pitch requirements (down to 0.12mm)—has pushed traditio...

Microvias in HDI PCB Design: Precision Interconnect Solutions for Next-Generation Electronics

| HEMEIXIN | New
The relentless demand for smaller, faster, and more feature-dense electronic devices has transformed high-density interconnect (HDI) printed circuit boards (PCBs) from a niche technology to a corne...

Microvias in PCB Design: A Comprehensive Guide to HDI Interconnect Solutions

| HEMEIXIN | New
In the era of miniaturized electronics, the demand for high-density interconnect (HDI) PCBs has skyrocketed. Consumer devices, industrial controllers, medical equipment, and aerospace systems incre...

Microvias in HDI PCB Design: Challenges, Solutions, and Industry Standards

| HEMEIXIN | New
Introduction Microvias (≤150µm diameter) are critical in high-density interconnect (HDI) PCBs, enabling miniaturization in 5G, IoT, and aerospace electronics. However, their adoption introduces ma...

Advanced HDI PCB Technology: State-of-the-Art Microvias, Metrics & Critical Applications

| HEMEIXIN | New
HDI PCB: Defining Attributes of Next-Gen Interconnects High-Density Interconnect (HDI) PCBs represent the pinnacle of circuit board technology, characterized by laser-drilled microvias (down ...

HDI PCBs: Advanced Design, Manufacturing & Performance Benefits

| HEMEIXIN | New
What is an HDI PCB? Key Definitions & Types A High Density Interconnect (HDI) PCB is a cutting-edge circuit board distinguished by blind/buried vias, microvias (≤0.006”/150μm diamete...

HDI PCBs: Advantages, Applications & Technical Superiority

| HEMEIXIN | New
What is an HDI PCB? Core Definition A High-Density Interconnect (HDI) PCB is a advanced circuit board characterized by high pin density (120–160 pins per square inch), dense component placeme...

HDI PCB Design Basics: Manufacturing Process, Materials & DFM Guidelines

| HEMEIXIN | New
What is HDI PCB? Core Concepts & Standards Definition & Evolution of HDI Technology High Density Interconnect (HDI) PCBs are advanced circuit boards optimized for packing more components ...

A Comprehensive Guide to High-Density Interconnect Technology

| HEMEIXIN | New
What is HDI PCB? Definition & IPC-2226 Standards Core Definition of High-Density Interconnect PCB Per the IPC-2226 international standard, a High-Density Interconnect (HDI) PCB is a printed c...

Cost and Performance: Skip Via or Blind Via in 12 Layers

| HEMEIXIN | New
Two critical via types used in HDI PCB design to lower interconnect density, enhance signal integrity, and maximize performance are skip vias and blind vias. Engineers frequently have to choose bet...

Halogen-free FR4 alternatives meeting UL 94 V-0 flammability for automotive applications

| HEMEIXIN | New
With the increasing emphasis on sustainability, fire safety, and compliance, the demand for halogen-free FR4 alternatives in automotive applications is rapidly growing. Traditional FR4 PCB material...
Copyright © 2025 Hemeixin Electronics Co, Ltd. All Rights Reserved.